PROJECT
Tool Install Design
Sector
Semiconductor
Location
Leixlip
Value
N/A
Precision 3D Modelling and Tool Install Integration
Duration
2020 – Present
Sector
Semiconductor
Customer
Confidential
Total
CONFIDENTIAL
Project Delivery Overview
BMD has been supporting this ongoing semiconductor project since 2020, providing full design and coordination of Wafer Fab Tool Install work packages. The scope includes laser scanning of work areas and 3D modelling of piping systems from LOD 200 to LOD 400.
The BMD BIM team has produced over 100,000 IFC isometric drawings to date, developing detailed fabrication and installation drawings for pipework, structural supports, and carrier systems. Extensive 3D model coordination was carried out with multiple specialty contractors to ensure seamless integration and precision across all disciplines.
Build Your Future with Us
Looking for a partner you can rely on to deliver your next project safely, efficiently, and on schedule?
